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ABB RF522 3BSE000743R1 Subrack 18SU
ABB RF522 3BSE000743R1 Subrack 18SU
Manufacturer: ABB
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Product No.: RF522 3BSE000743R1
Condition:in Stock
Product Type: Subrack 18SU
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Product Origin: Switzerland
Payment:T/T, Western Union
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Weight: 19300g
Shipping port: Shanghai/Yiwu/Shenzhen
Warranty: 12 months
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Product Overview
The RF522 (Part Number 3BSE000743R1) is a heavy-duty, utility-grade equipment subrack designed to serve as the primary structural and electrical housing for ABB industrial control systems. This 18-slot unit (18SU) comes factory-integrated with the BB512 backplane, providing a high-speed communication bus and stabilized power distribution for a wide array of ABB processing and I/O modules. Engineered for the "Large Equipment" category, the RF522 is built to withstand the mechanical stresses and electromagnetic interference (EMI) typical of power generation plants and heavy manufacturing facilities, ensuring that critical control logic remains physically secure and electrically isolated.
Technical Specifications
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Model Designation: RF522
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ABB Global ID: 3BSE000743R1
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Backplane Component: Integrated BB512 18SU Backplane
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Slot Capacity: 18 Standard Units (18SU)
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Functional Role: High-density mounting, module interconnection, and power bus distribution
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Physical Depth: 540 mm (21.26 in)
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Physical Height: 297 mm (11.69 in)
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Physical Width: 441 mm (17.36 in)
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Net Weight: 19.3 kg (Approx. 42.5 lbs)
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Construction Material: Industrial-grade reinforced alloy for vibration resistance
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Compliance: RoHS Compliant (EU Directive 2011/65/EU)
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WEEE Category: 4 (Large Equipment > 50 cm)
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HS Code: 853890 (Electrical equipment parts)
Structural Integrity and System Reliability
The RF522 is a cornerstone of "High-Availability" system design. Its significant mass (nearly 20 kg) is a mechanical necessity, providing the vibration dampening required to protect delicate backplane connectors from the structural harmonics often found in industrial turbine halls or pumping stations. The integrated BB512 backplane features optimized trace geometry to ensure low-latency data transfers between the controller and the I/O layer, effectively eliminating signal skew in high-density 18-module configurations. This subrack is the preferred choice for large-scale facility builds where long-term thermal stability and mechanical alignment are non-negotiable.
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